PCB Manufacturing Capability:
Article |
Description |
Capability |
|
Sercive |
PCB and SMT assembly with one-stop service |
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Material |
Laminate materials |
FR4, high TG FR4, high frequency, alum, FPC |
|
Board cutting |
Number of layers |
1-48 |
|
Min.thickness for inner layers (Cu thickness are excluded) |
0.003”(0.07mm) |
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Board thickness |
Standard |
(0.1-4mm±10%) |
|
Min. |
Single/Double:0.008±0.004” |
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4layer:0.01±0.008” |
|||
8layer:0.01±0.008” |
|||
Bow and twist |
no more than 7/1000 |
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Copper weight |
Outer Cu weight |
0.5-4 0z |
|
Inner Cu weight |
0.5-3 0z |
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Drilling |
Min size |
0.0078”(0.2mm) |
|
Drill deviation |
±0.002″(0.05mm) |
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PTH hole tolerance |
±0.002″(0.005mm) |
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NPTH hole tolerance |
±0.002″(0.005mm) |
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Solder mask
|
Color |
Green,white,black,red,blue… |
|
Min solder mask clearanace |
0.003″(0.07mm) |
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Thickness |
(0.012*0.017mm) |
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Silkscreen |
Color |
white,black,yellow,blue… |
|
Min size |
0.006″(0.15mm) |
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E-test |
Function Test |
100% Functional test |
|
PCBA Testing |
X-ray,AOI Test,Functional test |
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Pcb assembly |
one-stop service electronic manufacxturer service |
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Component sourcing |
Yes |
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Certificate |
IATF16949, ISO13485, ISO9001 |
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Delivery time: |
PCB |
3-8days |
|
PCBA |
10-20days |
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Tolerance of pcb |
±5% |
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Max size of finish board |
700*460mm |
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MOQ |
NO MOQ (1pcs) |
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Surface Finish |
HASL,ENIG,immersion silver,immersion tin,OSP… |
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PCB outline |
Square,circle,irregular(with jigs) |
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package |
QFN,BGA,SSOP,PLCC,LGA |
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Sub-assembly |
Plastic,metal,screen |
PCB MANUFACTURING PROCESSES

-step 1-
Customer data pre-review

-Step 2-
Sales quotation

-Step 3-
Engineering data production

-Step 4-
Cutting, drilling

-Step 5-
Graphics transfer

-Step 6-
Electroplating, etching

-Step 7-
Solder mask, text

-Step 8-
Surface treatment process

-Step 9-
Forming

-Step 10-
Inspection

-Step 11-
Shipment

-Step 12-
Service